Dachuang Kehua potting adhesive is a type of adhesive with superior performance, long applicability, and suitable for large-scale automated production line operations. It has adhesive properties for various substrates and can achieve waterproof, high and low temperature resistance, weather resistance, and thermal conductivity after curing. Provide customized sealing adhesive application solutions Widely used, it can be applied in industries such as new energy, military, medical, aviation, shipbuilding, electronics, automobiles, household appliances, instruments, power supplies, high-speed rail, etc Business field It has excellent electrical strength and chemical stability, weather resistance, waterproof, moisture-proof, shockproof, corrosion-free, non-toxic, odorless, easy to pour, deep vulcanization, low shrinkage rate, simple operation, and can be used for a long time at -65~250C:
Serial number | Testing item | Implementation Standards | Unit | Brand | ||
DC2220 | DC2240 | DC2260 | ||||
1 | Viscosity A | GB/T2794-2013 | mpa-s | 5100±500 | 5100±500 | 5100±500 |
2 | Viscosity B | GB/T2794-2013 | mpa-s | 4900±500 | 4900±500 | 4900±500 |
3 | Specific Gravity | GB/13477.2-2002 | / | 0.2 | 0.4 | 0.6 |
4 | Operable time | GB/T13477.5-2002 | min | 5 | 20 | 20 |
5 | Tensile strength | GB/T528-2009 | Mpa | >0.25 | >0.35 | >0.5 |
6 | Elongation | GB/T528-2009 | % | >65 | >90 | >110 |
7 | Volume resistance | ASTM D257 | Q-cm | >1014 | >1014 | >1014 |
8 | Voltage resistance | ASTM D149 | kV/mm | >18 | >18 | >18 |
9 | Flame retardancy | UL-94 | / | V-0 | V-0 | V-0 |
10 | Thermal conductivity (W/m-k) | ASTM D5470 | / | 0.05 | 0.07 | 0.09 |
Thermally Conductive Potting Adhesives | ||||||
Serial number | Testing items | Implementation Standards | Unit | Brand | ||
DC2108 | DC2110 | DC2115 | ||||
1 | Viscosity A | GB/T 2794-2013 | mpa-s | 5100±500 | 9000±500 | 20500±500 |
2 | Viscosity B | GB/T 2794-2013 | mpa-s | 4900±500 | 8900±500 | 20000±500 |
3 | Specific Gravity | GB/13477.2-2002 | / | 1.7 | 1.9 | 2.1 |
4 | Surface drying time | GB/T13477.5-2002 | min 25°C | 60 | 60 | 60 |
5 | Curing time | GB/T13477.5-2002 | h 25°C | 24 | 24 | 24 |
6 | Volume resistance | ASTM D257 | Qcm | >1014 | >1014 | >1014 |
7 | Voltage resistance | ASTM D149 | kV/mm | >18 | >18 | >18 |
8 | Flame retardancy | UL-94 | / | V-0 | V-0 | V-0 |
9 | Thermal conductivity (W/m-k) | ASTM D5470 | / | 0.8 | 1 | 1.5 |
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